Bumping electronic components using transfer substrates
US7842599B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2007 |
| Grant date | Nov 30, 2010 |
| Priority date | — |
| Expiry date | Feb 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1581
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of material having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.