Aaron Hahn
1Patents
0h-index
9Co-inventors
19Inventor score
Filing activity: May 6, 2019 → May 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11963308B2 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.