Patent · US Active

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

US11963308B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Norbert Lützow · Berlin, DE
Wonjin Cho · Seojong-myeon, KR
Toshio Honda · Yokohama, JP
Dirk Tews · Berlin, DE
Markku LAGER · Berlin, DE
Felix Tang · Berlin, DE
Mirko Kloppisch · Berlin, DE
Aaron Hahn · Berlin, DE
Gabriela Schmidt · Berlin, DE
Martin Thoms · Berlin, DE

Key dates

Filing date	May 6, 2019
Grant date	Apr 16, 2024
Priority date	—
Expiry date	Feb 26, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/124
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.