Aaron M. Ramirez
2Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Dec 2, 2013 → Mar 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9142694B2 | Focal plane array packaging using isostatic pressure processing | Electricity | 1 | Active |
| US12002773B2 | Hybrid pocket post and tailored via dielectric for 3D-integrated electrical device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.