Aaron Vaisman
8Patents
2h-index
3Co-inventors
40Inventor score
Filing activity: May 17, 2012 → Aug 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9300022B2 | Vaisman baluns and microwave devices employing the same | Electricity | 9 | Active |
| US10861803B1 | Low cost millimeter wave integrated LTCC package and method of manufacturing | Electricity | 2 | Active |
| US11744057B1 | Method and apparatus for a shielding structure of surface-mount devices | Electricity | 1 | Active |
| US9949361B1 | Geometrically inverted ultra wide band microstrip balun | Electricity | 1 | Active |
| US11430752B1 | Low cost millimiter wave integrated LTCC package | Electricity | 0 | Active |
| US9030269B1 | Tunable microstrip and T-junction | Electricity | 0 | Active |
| US11638370B1 | Method and apparatus for a shielding structure of surface-mount LTCC devices | Electricity | 0 | Active |
| US11324111B1 | Apparatus for shielding of surface-mount devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.