Low cost millimeter wave integrated LTCC package and method of manufacturing
US10861803B1 · kind B1 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.