Ada Shen
1Patents
0h-index
7Co-inventors
19Inventor score
Filing activity: Apr 13, 2021 → Apr 13, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11488883B1 | Semiconductor device package having thermally conductive layers for heat dissipation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.