Adam J. DeGrush
2Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: May 7, 1998 → Oct 13, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6159754A | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die | Electricity | 10 | Expired |
| US6376919B1 | Circuit edit interconnect structure through the backside of an integrated circuit die | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.