Adrian Arcedera
12Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Feb 9, 2010 → Feb 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9932221B1 | Semiconductor package with multiple compartments | Electricity | 8 | Active |
| US8441120B1 | Heat spreader package | Electricity | 7 | Active |
| US7999371B1 | Heat spreader package and method | Electricity | 3 | Active |
| US10221064B2 | Semiconductor package with multiple compartments | Electricity | 3 | Active |
| US10032726B1 | Embedded vibration management system | Electricity | 1 | Active |
| US10843918B2 | Semiconductor package with multiple compartments | Electricity | 1 | Active |
| US11505452B2 | Semiconductor device | Electricity | 0 | Active |
| US10822226B2 | Semiconductor package using a polymer substrate | Electricity | 0 | Active |
| US11908755B2 | Semiconductor devices and methods of manufacturing semiconductor devices | Electricity | 0 | Active |
| US11572269B2 | Semiconductor package using a polymer substrate | Electricity | 0 | Active |
| US10861798B2 | Embedded vibration management system having an array of vibration absorbing structures | Electricity | 0 | Active |
| US12187603B2 | Semiconductor package using a polymer substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.