Embedded vibration management system having an array of vibration absorbing structures
US10861798B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jul 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.