Aihua Lu
3Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Jun 30, 2012 → Jun 12, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9653383B2 | Semiconductor device with thick bottom metal and preparation method thereof | Electricity | 14 | Active |
| US9087828B2 | Semiconductor device with thick bottom metal and preparation method thereof | Electricity | 2 | Active |
| US8722467B2 | Method of using bonding ball array as height keeper and paste holder in semiconductor device package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.