Al Vindasius
4Patents
2h-index
3Co-inventors
33Inventor score
Filing activity: Dec 17, 2004 → Dec 27, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7215018B2 | Stacked die BGA or LGA component assembly | Electricity | 63 | Expired |
| US7245021B2 | Micropede stacked die component assembly | Electricity | 38 | Expired |
| US7705432B2 | Three dimensional six surface conformal die coating | Electricity | 0 | Expired |
| US8729690B2 | Assembly having stacked die mounted on substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.