Assembly having stacked die mounted on substrate
US8729690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to the electrical connection pads. After being placed atop one another in a stack, vertically adjacent die or die segments can be electrically interconnected using a flexible bond wire or bond ribbon attached to an electrical connection pad exposed within such opening, the bond wire or ribbon protruding horizontally, and an electrically conductive polymer, or epoxy, filaments or lines can be applied to the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.