Alex Matson
5Patents
2h-index
9Co-inventors
36Inventor score
Filing activity: Jan 25, 2013 → Sep 25, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9741591B2 | Wafer level packaging of microbolometer vacuum package assemblies | Electricity | 13 | Active |
| US10518499B2 | Foldable composite material sheet and structure | Emerging Cross-Sectional Technologies | 3 | Active |
| US10553454B2 | Wafer level packaging of microbolometer vacuum package assemblies | Electricity | 1 | Active |
| US9513172B2 | Wafer level packaging of infrared camera detectors | Emerging Cross-Sectional Technologies | 0 | Active |
| US10161803B2 | Wafer level packaging of infrared camera detectors | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.