Wafer level packaging of infrared camera detectors
US10161803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2016 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.