Ali Elashri
5Patents
0h-index
17Co-inventors
28Inventor score
Filing activity: Feb 18, 2021 → Dec 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12222776B1 | Heat sinks for bare die multi-chip packages | Physics | 0 | Active |
| US12035495B1 | Board physical placement verification in a server chassis | Electricity | 0 | Active |
| US11751354B1 | Anti-sag modular server chassis assembly | Electricity | 0 | Active |
| US12315779B1 | Vapor chamber heat spreader for bare die processors | Electricity | 0 | Active |
| US11910566B1 | Processor heat exchanger with separate mounting structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.