Heat sinks for bare die multi-chip packages
US12222776B1 · kind B1 · utility
0Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jan 4, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.