Allen S. Lim
3Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Aug 17, 2005 → Nov 7, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7327043B2 | Two layer substrate ball grid array design | Electricity | 1 | Active |
| US8370777B2 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Electricity | 1 | Active |
| US8946871B2 | Thermal improvement of integrated circuit packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.