Amarjit Dhadda
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Jun 6, 2011 → Jun 6, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8987898B2 | Semiconductor wafer with reduced thickness variation and method for fabricating same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.