André Steiner
2Patents
0h-index
3Co-inventors
27Inventor score
Filing activity: Feb 6, 2013 → Jul 31, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12206044B2 | Semiconductor component with a stress compensation layer and a method for manufacturing a semiconductor component | Electricity | 0 | Active |
| US10597183B2 | Apparatus for heat shrinking a package and method for heat shrinking a package | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.