Andrei Papou
23Patents
7h-index
21Co-inventors
65Inventor score
Filing activity: Jul 27, 2006 → Jan 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7468899B1 | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits | Emerging Cross-Sectional Technologies | 15 | Active |
| US7936246B2 | On-chip inductor for high current applications | Emerging Cross-Sectional Technologies | 15 | Active |
| US8466537B1 | MEMS power inductor with magnetic laminations formed in a crack resistant high aspect ratio structure | Electricity | 14 | Active |
| US7755463B2 | Integrated circuits with inductors | Emerging Cross-Sectional Technologies | 13 | Active |
| US8314676B1 | Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors | Emerging Cross-Sectional Technologies | 11 | Active |
| US7584533B2 | Method of fabricating an inductor structure on an integrated circuit structure | Emerging Cross-Sectional Technologies | 8 | Active |
| US7829425B1 | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits | Electricity | 8 | Active |
| US7652348B1 | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits | Electricity | 7 | Active |
| US8042260B2 | Methods of forming inductors on integrated circuits | Emerging Cross-Sectional Technologies | 4 | Active |
| US8410576B2 | Inductive structure and method of forming the inductive structure with an attached core structure | Emerging Cross-Sectional Technologies | 4 | Active |
| US8390093B1 | System and method of galvanic isolation in digital signal transfer integrated circuits utilizing conductivity modulation of semiconductor substrate | Electricity | 3 | Active |
| US7897472B2 | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits | Electricity | 3 | Active |
| US8205324B2 | Method of fabricating an inductor structure | Emerging Cross-Sectional Technologies | 2 | Active |
| US9024397B2 | Thermally-insulated micro-fabricated atomic clock structure and method of forming the atomic clock structure | Emerging Cross-Sectional Technologies | 2 | Active |
| US8407883B2 | Magnetically enhanced power inductor with self-aligned hard axis magnetic core produced in an applied magnetic field using a damascene process sequence | Emerging Cross-Sectional Technologies | 1 | Active |
| US7525323B1 | Method for measuring permeability of a ferromagnetic material in an integrated circuit | Physics | 1 | Active |
| US9121106B2 | Method of forming a laminated magnetic core with sputter deposited and electroplated layers | Electricity | 1 | Active |
| US10665735B2 | Micro-fabricated atomic clock structure and method of forming the atomic clock structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US8531002B2 | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits | Electricity | 0 | Active |
| US11961875B2 | Monolithic segmented LED array architecture with islanded epitaxial growth | Electricity | 0 | Active |
| US10957820B2 | Monolithic, segmented light emitting diode array | Electricity | 0 | Active |
| US8450830B2 | Forming a ferromagnetic alloy core for high frequency micro fabricated inductors and transformers | Emerging Cross-Sectional Technologies | 0 | Active |
| US8338913B2 | Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.