Andrew Hoitink
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Dec 6, 2016 → Dec 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11639556B2 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Electricity | 0 | Active |
| US10324112B2 | Package testing system and method with contact alignment | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.