Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays
US11639556B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Dec 28, 2017 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | May 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.