Andrzej Prochaska
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jun 18, 2001 → Jun 18, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6551851B2 | Production of diaphragms over a cavity by grinding to reduce wafer thickness | Performing Operations; Transporting | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.