Andy Fan
4Patents
4h-index
5Co-inventors
43Inventor score
Filing activity: Sep 5, 2003 → Jul 20, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7307003B2 | Method of forming a multi-layer semiconductor structure incorporating a processing handle member | Electricity | 292 | Expired |
| US7064055B2 | Method of forming a multi-layer semiconductor structure having a seamless bonding interface | Electricity | 9 | Expired |
| US10768185B2 | Tenofovir detection assay | Physics | 5 | Active |
| US9863552B2 | Fluid valve and a single shaft-sealing module thereof | Emerging Cross-Sectional Technologies | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.