Anthony Odejar
2Patents
2h-index
2Co-inventors
27Inventor score
Filing activity: Feb 26, 1999 → Sep 26, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6331728A | High reliability lead frame and packaging technology containing the same | Electricity | 13 | Expired |
| US6576491B1 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.