Aruna Manoharan
3Patents
0h-index
8Co-inventors
27Inventor score
Filing activity: Mar 23, 2017 → Mar 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12087671B2 | Overmolded microelectronic packages containing knurled flanges and methods for the production thereof | Electricity | 0 | Active |
| US10998255B2 | Overmolded microelectronic packages containing knurled flanges and methods for the production thereof | Electricity | 0 | Active |
| US10134660B2 | Semiconductor device having corrugated leads and method for forming | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.