Semiconductor device having corrugated leads and method for forming
US10134660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Mar 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48095
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.