Bart Vandevelde
4Patents
2h-index
15Co-inventors
41Inventor score
Filing activity: Dec 19, 1997 → Jul 2, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6036836A | Process to create metallic stand-offs on an electronic circuit | Electricity | 15 | Expired |
| US8493736B2 | Device for cooling integrated circuits | Electricity | 11 | Active |
| US9105827B2 | Method for bonding semiconductor substrates | Electricity | 2 | Active |
| US8772131B2 | Method for bonding semiconductor substrates | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.