Bartholomew Liao
5Patents
2h-index
12Co-inventors
40Inventor score
Filing activity: Dec 26, 2013 → Dec 7, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9330994B2 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Electricity | 16 | Active |
| US9202793B1 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Electricity | 2 | Active |
| US9627338B2 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Electricity | 1 | Active |
| US11227809B2 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Electricity | 0 | Active |
| US12148677B2 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.