Integrated circuit packaging system with under bump metallization and method of manufacture thereof
US9202793B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2013 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.