Bee Hoon Liau
1Patents
1h-index
7Co-inventors
25Inventor score
Filing activity: Oct 31, 2005 → Oct 31, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7554185B2 | Flip chip and wire bond semiconductor package | Electricity | 17 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.