Ben Tan
6Patents
2h-index
5Co-inventors
40Inventor score
Filing activity: Oct 29, 2002 → Feb 18, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8886840B2 | System and method for implementing a single chip having a multiple sub-layer PHY | Electricity | 7 | Active |
| US7372329B1 | Method and apparatus to remove the DC component of a feedback signal | Electricity | 3 | Active |
| US8473640B2 | System and method for implementing a single chip having a multiple sub-layer PHY | Electricity | 1 | Active |
| US8230114B2 | System and method for implementing a single chip having a multiple sub-layer PHY | Electricity | 1 | Active |
| US7944292B1 | Method and apparatus to remove the DC component of a feedback signal | Electricity | 0 | Active |
| US11196385B2 | System and method of improving blocking immunity of radio frequency transceiver front end | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.