Benyang Wu
1Patents
0h-index
9Co-inventors
19Inventor score
Filing activity: Dec 1, 2021 → Dec 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11714649B2 | RISC-V-based 3D interconnected multi-core processor architecture and working method thereof | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.