Bernd Seitz
2Patents
0h-index
11Co-inventors
35Inventor score
Filing activity: Mar 6, 2009 → Feb 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11536594B2 | Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component | Electricity | 0 | Active |
| US8427136B2 | Magnetic displacement sensor | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.