Patent · US Active

Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component

US11536594B2 · kind B2 · utility

0Cited by

10References

18Claims

0Family size

Assignee

Vitesco Technologies Germany GmbH · DE

Inventors

Jürgen Rietsch · Hof, DE
Andreas Plach · Forchheim, DE
Stephan Bandermann · Teublitz, DE
Thomas Schmidt · Thierhaupten, DE
Andreas Albert · Höchstadt an der Aisch, DE
Klaus Scharrer · Hohenstadt, DE
Bernd Seitz · Nuremberg, DE
Jens mEnke · Allersberg, DE

Key dates

Filing date	Feb 21, 2020
Grant date	Dec 27, 2022
Priority date	—
Expiry date	Aug 16, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1327
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.