Beverly J. Canham
3Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Dec 30, 2003 → Apr 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6974726B2 | Silicon wafer with soluble protective coating | Electricity | 13 | Expired |
| US9330993B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 1 | Active |
| US10115606B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.