Silicon wafer with soluble protective coating
US6974726B2 · kind B2 · utility
13Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Dec 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.