Bhoy Ching
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Sep 18, 2007 → Sep 18, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7701042B2 | Integrated circuit package system for chip on lead | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.