Bih Wen Fon
3Patents
2h-index
4Co-inventors
30Inventor score
Filing activity: Jan 20, 2012 → Oct 30, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9281258B1 | Chip scale packages and related methods | Electricity | 4 | Active |
| US8759978B2 | Chip-on-lead package and method of forming | Electricity | 3 | Active |
| US9018044B2 | Chip-on-lead package and method of forming | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.