Bihua He
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Dec 15, 2016 → Dec 15, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9997445B2 | Substrate interconnections for packaged semiconductor device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.