Bogdan BANKIEWICZ
2Patents
0h-index
7Co-inventors
27Inventor score
Filing activity: May 11, 2018 → Sep 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11842974B2 | Solder material and method for die attachment | Electricity | 0 | Active |
| US12388042B2 | Solder material and method for die attachment | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.