Solder material and method for die attachment
US12388042B2 · kind B2 · utility
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4References
15Claims
0Family size
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Key dates
| Filing date | Sep 19, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Sep 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.