Bonggi Kim
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jun 22, 1987 → Jun 22, 1987
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4824803A | Multilayer metallization method for integrated circuits | Electricity | 37 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.