Boon Seng Tan
2Patents
1h-index
3Co-inventors
33Inventor score
Filing activity: Dec 29, 2000 → Jun 29, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7220624B2 | Windowed package for electronic circuitry | Electricity | 5 | Expired |
| US7242088B2 | IC package pressure release apparatus and method | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.