IC package pressure release apparatus and method
US7242088B2 · kind B2 · utility
0Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2000 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.