Boris Relja
3Patents
3h-index
8Co-inventors
36Inventor score
Filing activity: Mar 3, 2000 → Apr 1, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6365502B1 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 94 | Expired |
| US6627995B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 42 | Expired |
| US6645847B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 37 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.