Brian J. Thibault
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Nov 16, 2004 → Nov 16, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7387911B2 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.