Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
US7387911B2 · kind B2 · utility
5Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2004 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Nov 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips. During subsequent electrical operation of a diced chip, the thin thermally conductive film functions as a thermal conductor to dissipate and conduct away to a heat sink any heat generated during operation of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.