Brian L. Singletary
5Patents
2h-index
10Co-inventors
40Inventor score
Filing activity: Mar 22, 2005 → Aug 5, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7348667B2 | System and method for noise reduction in multi-layer ceramic packages | Electricity | 12 | Expired |
| US7863724B2 | Circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 8 | Active |
| US8634877B2 | Automatic escalation/degradation of notifications of repetitive calls | Electricity | 1 | Active |
| US8586476B2 | Fabrication method for circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 1 | Active |
| US8722536B2 | Fabrication method for circuit substrate having post-fed die side power supply connections | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.